Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

The following text will discuss the different theoretical and mathematical principles working behind geometry processing. It will also discuss how they are applied to different purposes while ...

Annular dark field scanning electron microscopy images of a bilayer interface after heat pulses at 500° (left), 600° (middle) and 700° (right). Dashed colored lines mark the positions of the interface ...